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PM01-CPB PEELMASTER

01 / features

EFEM HANDLING
In-house developed EFEM (Equipment Front End Module) system
 

STANDALONE SOLUTION
Fully automated; each panel returns to its original position after processing
 

GLASS HANDLING
Thoroughly tested system capable of handling glass panels up to 200µm thick
 

VARIETY OF DRY FILMS
Supports processing of various dry films, including ABF, DFR, SR, and more
 

COMPLIANCE WITH INDUSTRY STANDARDS
Meets SEMI and SECS-GEM standards
 

TEAR DETECTION
Accurate detection of torn protective films
 

EASY WASTE MANAGEMENT
Efficient waste management with almost endless roll winding
 

CAMERA STATION FOR ID READING
Supports DMC, drilled codes, or notches

PMS201-EFEM:
PEELMASTER for IC-SUBSTRATES with EFEM–HANDLING

Building on the success of the PMA peeler concept, which has been proven effective for over three decades, a new peeler has been developed specifically for removing Dry-Film protective films from IC substrates in the semiconductor industry. This machine features an in-house developed Equipment Front End Module (EFEM) to process panels in compliance with SEMI standards. Additionally, it includes a unique vertical HOST communication system that adheres to the SECS-GEM (GEM 300) standard.

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02 / specifications
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SUBSTRATE TYPES

  • Glass

  • Glass Core

  • Copper Core Laminate
     

PANEL SIZE

Standard: 510 x 515 mm

Optional: Up to 650 x 650 mm
 

PANEL THICKNESS

200 µm – 3.5 mm

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CLEANROOM SUITABLE

Class ISO 5
Optional: Class ISO 4
 

DRY FILM TYPES

  • DFR

  • SR

  • ABF

  • And more

 

LOADPORTS

Two FOUPs with 6 or 12 slots

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