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PM01-CPB PEELMASTER
01 / features
EFEM HANDLING
In-house developed module for precise SEMI-compliant panel handling
STANDALONE OPERATION
Fully automated; panels return to original positions after processing
GLASS HANDLING
Reliably processes glass panels down to 200 µm
DRY FILM FLEXIBILITY
Supports ABF, DFR, SR, and more
INDUSTRY COMPLIANCE
Meets SEMI and SECS-GEM standards
TEAR DETECTION
Accurate detection of torn protective films
EFFICIENT WASTE MANAGEMENT
Almost endless roll winding for clean, simple disposal
CAMERA STATION
Reads DMC, drilled codes, and notches
PEELER PMS201-EFEM:
Advanced Peeling with EFEM–HANDLING
The PMS201-EFEM is AE’s dedicated system for removing Dry-Film protective layers from IC substrates in semiconductor production. Built on over three decades of proven PMA peeling technology, it integrates an in-house developed EFEM for precise, SEMI-compliant handling. A vertical HOST communication system ensures seamless SECS-GEM (GEM 300) integration, making it the perfect fit for modern semiconductor production environments.
02 / specifications
SUBSTRATE TYPES
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Glass
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Glass Core
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Copper Core Laminate
PANEL SIZE
Standard: 510 x 515 mm (20.1" x 20.3")
Optional: Up to 650 x 650 mm (25.6" x 25.6")
PANEL THICKNESS
200 µm – 3.5 mm
CLEANROOM SUITABLE
Class ISO 5
Optional: Class ISO 4
DRY FILM TYPES
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DFR
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SR
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ABF
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And more
LOADPORTS
Two FOUPs with 6 or 12 slots
