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Solutions Overview
MYLAR SHEET REMOVERS

IC-SUBSTRATE &
PANEL-LEVEL PACKAGING
SOLUTIONS


01 / MYLAR SHEET REMOVERS

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PEELER PMT101
ALL-IN-ONE PEELING FOR IC SUBSTRATAES

  • Third iteration of the world's most successful automated mylar peeler 

  • Specifically developed for IC-substrates (ABF, DFR, SR etc.)​
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PEELER PMS301
PRECISION PEELING FOR IC SUBSTRATES

  • Updated version of the world's most successful automated mylar peeler 

  • For ABF and glass substrates

  • Additional knurling device for process stability​​​​
     

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PEELER PMS201-EFEM
ADVANCED PEELING WITH EFEM-HANDLING

  • Designed for IC-substrates (ABF, DFR, SR etc.)

  • Specifically developed for removing dry-film protective films

  • Glas core compatible

  • Equipped with an in-house developed EFEM

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