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PM01-CPB PEELMASTER
01 / features
VERSATILE FILM PROCESSING
Handle ABF, DFR, DFSR, and SR films with ease
COMPACT DESIGN
Most space-efficient machine on the market
ENHANCED STABILITY
Additional knurling device for consistent, reliable peeling
TOP- & BOTTOM-SIDE PEELING
Single-step operation for maximum throughput
FULL ENCLOSURE
Ensures optimal cleanliness and safety
PEELER PMS301:
Precision Peeling for IC Substrates
The PMS301 combines AE’s proven peeling technology with an integrated Pre-Knurling, Center, and Buffer Cell for maximum reliability. It prepares the film surface before peeling, enabling safe and consistent removal of ABF, DFR, DFSR, and SR films, even on ultra-thin substrates.
02 / specifications
PANEL SIZE
L: 350mm - 635mm (13.8" - 25")
W 380mm- 635mm (15" - 25")
PANEL THICKNESS
200 µm – 3.5 mm
SUBSTRATE TYPES
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Glass
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Glass Core
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CCL / Copper Clad Laminate
CLEANROOM SUITABLE
Sterile operation
